TOP 3 Interconnect leaflets 2015
(Published 2015-12- by Theo Hooft)

With the year ending here is our TOP 3 list of 2015 interesting interconnect technologies based on leaflet requests: Our number 3: Miniature and micro RF compatible with I-pex, Hirose, SMK, Amphenol and others. Our number 2: Modular backplane cabling systems for 1.8 mm, 2.00 mm, 2,54 mm ( VME, CPCI and VPX). The top position is this year for goldwire elastomeric technology the innovative technology to create fine pitch board to board, flex to board interconnects with pitches far below 0,3 mm! Did you miss one of them? Go to the download area.

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